Etchants for Gold and Alloys

22K/Sterling silver BiMetal (Au-Ag) - Alloy composition in the weight % 12.5% 22K gold, 87.5% sterling silver
22k gold-Au - Chemical etching
ASTM etchant No. 61 - >90% noble metals - Chemical etching
ASTM etchant No. 61 - For Au and noble metals (> 90%)
ASTM etchant No. 61 - Pure gold - Chemical etching
ASTM etchant No. 62 - Au alloys - Chemical etching
ASTM etchant No. 62 - For Au and alloys
ASTM etchant No. 62 - Pure gold - Chemical etching
ASTM etchant No. 63 - Au alloys - Chemical etching
ASTM etchant No. 63 - For Au (polish) and Au alloys
ASTM etchant No. 63 - Pure gold - Chemical etching
ASTM etchant No. 64 - For Au alloys
ASTM etchant No. 64b - Au alloys - Chemical etching
ASTM etchant No. 65 - <90% noble metals - Chemical etching
ASTM etchant No. 65 - For noble metals (< 90%)
Agua regia - Au thin films and specimens - Chemical etching
Agua regia - AuSn (20%) alloy as an evaporated thin film - Chemical etching
Agua regia - Pure Au, Au-Pt and Au-Ag alloys with more than 80% Au - Chemical etching
Aqua regia - Au-Al alloys - Chemical etching - General microstructure
Aqua regia - Gold - Chemical etching
Aqua regia - Pure Au and alloys
Aqua regia - Pure gold - Chemical etching
Au (100) single crystal thin films - Specimen preparation
Au (111) and (100) single crystal blanks - Chemical etching - General microstructure
Au (111) wafers and other orientations - Chemical etching - General microstructure
Au alloys - Chemical etching
Au alloys - Chemical etching
Au alloys - Chemical etching
Au alloys - Chemical etching
Au and Au alloys - Chemical etching
Au and Au alloys - Electrolytic etching - General microstructure
Au and alloys - Chemical etching
Au and alloys - Electrolytic etching
Au and alloys - Electrolytic etching
Au as hard gold coatings on copper substrates - Metal plating
Au as single crystal blanks - Abrasive polishing
Au diffused into silicon - Chemical etching - General microstructure
Au diffused into silicon wafers - Chemical etching - General microstructure
Au foil - Eletrolytic polishing
Au polycrystalline specimens - Acid, float-off
Au single crystal spheres - Thermal forming
Au slugs or wire - Chemical cleaning
Au specimens - Chemical etching - General microstructure
Au specimens - Electrolytic polishing
Au specimens - Electrolytic polishing
Au specimens - Oxide removal
Au specimens and thin films - Chemical etching - General microstructure
Au spherulitic particles - Chemical etching - General microstructure
Au thin film deposited by CVD - Metal diffusion
Au thin film deposited on glass - Chemical etching - General microstructure
Au thin film deposits on silicon wafers - Chemical etching - General microstructure
Au thin films - Chemical ecthing
Au thin films - Electrolytic polishing
Au thin films - Gas, diffusion
Au thin films - Thermal etching
Au thin films deposited on (0001) muscovite mica substrates - Acid, float-off
Au thin films deposited on (100) NaCl substrates - Acid, float-off
Au thin films deposited on glass - Chemical etching - General microstructure
Au thin films deposited on soda-lime glass - Thermal, structure
Au thin films evaporated on alumina substrates - Gas, drying
Au thin films pulse plated on alumina blanks - Gold plating
Au-20Sn & Sn-36Pb-2Ag alloys - Chemical etching - General microstructure
Au-Ag-Cu alloys - Chemical etching - General microstructure
Au-Ag-Cu alloys - Chemical etching - General microstructure
Au-B alloys - Chemical etching - General microstructure
Au-Cd alloy - Electrolytic polishing
Au-Cd alloy specimens - Chemical polishing
Au-Cd alloys - Also etches dislocation, grain boundaries
Au-Cd alloys - Chemical etching - General microstructure
Au-Co alloys - Electrolytic thinning
Au-Co alloys - For alloys with bellow 22 at.% Co
Au-Cr alloys - Cast alloys with < 41.5 at % Cr and > 95 at.% Cr
Au-Cr alloys - Electrolytic thinning
Au-Cr alloys - Jet electrolytic polishing
Au-Cu alloy - Cu3Au - Electrolytic thinning
Au-Cu alloy - Cu3Au - Electrolytic thinning
Au-Cu alloy - Cu3Au - Electrolytic thinning
Au-Cu alloy - Cu3Au- Electrolytic thinning
Au-Cu alloy - Electrolytic polishing
Au-Cu alloy - Electrolytic polishing and etching
Au-Cu alloy - For alloys with 25 at.% Au
Au-Cu alloys - For cast alloys - General microstructure
Au-Cu-Ag alloy - Au-36 at.% Cu-11 at.% Ag
Au-Cu-Ag alloys - Chemical etching
Au-Cu-Ag alloys - For Au-Cu-Ag alloys - General microstructure
Au-Cu-Co alloys - Chemical etching - General microstructure
Au-Fe alloys - For cast alloys with bellow 24 at.% Fe - General microstructure
Au-Ga alloys - For cast alloys with less then 12.7 at.% Ga
Au-Ga system - Chemical etching - General microstructure
Au-Ga thin films EB evaporated on NaCl (100) substrates - Gas, aging defects
Au-Ge alloys - For cast alloys with < 2.5 at.% Ge
Au-In alloy specimens - Chemical polishing
Au-In-Pb system - Alloys with 40-95 wt.% Pb, 30-5% AuIn2 may be examined unetched
Au-In-Te - Chemical etching - General microstructure
Au-Mn alloy - Electrolytic thinning
Au-Mn alloys - Electrolytic polishing
Au-Ni alloys - Electrolytic polishing
Au-Ni-Fe system - Fe-4Au-2Ni - General microstructure
Au-Ni-Fe system - Used on gold plated Ni-Fe alloys for intermediate layer diffusion
Au-Pb-Sn alloys - Chemical etching
Au-Sn-Pb alloys - AuSn-Pb section of diagram Au-Sn-Pb
Au-Sn-Pb alloys - Chemical etching - General microstructure
Au-Ti alloys - For cast alloys <12.3 at.% Ti - General microstructure
Au-V alloy (Au4V) - Electrolytic thinning
Au-V alloys - For cast alloys with < 60 at.% V and > 41.5 at.% V
Au-V system - Chemical etching - General microstructure
Au-Zn alloys - For cast alloys with < 30 at.% Zn
Au-Zn as an evaporated metal contact on InGaAsP/InP(100) - Chemical ecthing
Au2Bi specimens - Chemical etching
Au2Bi specimens as Bi-Au2Bi - Chemical etching
Au2Cs specimens - Chemical etching - Aqua regia, dilute
Au2Ga thin films - Ionized gas thinning
AuAg(x) single crystal ingots - Chemical etching - General microstructure
AuGa2 (100) oriented thin films on NaCl - Chemical etching - General microstructure
AuGe (13%) alloy as Au/AuGe/Ni evaporated multilayered films - Chemical etching - General microstructure
AuGe (13%) alloy as pellets, sheets - Chemical etching - General microstructure
AuHg alloy specimens - Chemical polishing
AuSn (20%) alloy as evaporated thin films - Chemical etching - General microstructure
AuSn (20%) alloy ribbon - Chemical etching - General microstructure
AuSn (20%) alloy ribbon - Chemical etching - Tri-iodine etchant, modified
AuTi thin films - Chemical thinning
Chrome etchant - Au thin films and specimens - Chemical etching
Chrome etchant - Au-Cr thin films - Chemical etching
Cu-Au alloys - Electrolytic polishing and micro etching
Etching 14k Gold - For alloy with 70% Cu, 20% Ag, 10% Zn and also some amount of Si
Etching of gold - Chemical and electrolytic etching
Gold - - Electrolytic polishing
Gold - - Electrolytic polishing
Gold - Electrolytic polishing
Gold - Attack polishing
Gold - Attack polishing
Gold - Au alloys with less than 90% content of precious metals
Gold - Au, Pt alloys and Pd alloys - General macrostructure
Gold - Chemical etching - General microstructure
Gold - Chemical etching - General microstructure
Gold - Electrolytic lapping
Gold - Electrolytic polishing
Gold - Electrolytic polishing
Gold - Electrolytic polishing
Gold - Electrolytic polishing
Gold - Electrolytic polishing
Gold - Electrolytic polishing
Gold - Electrolytic polishing
Gold - Electrolytic polishing
Gold - Electrolytic polishing
Gold - Electrolytic thinning
Gold - Etching for etch pits
Gold - For Au alloys with high content of precious metals
Gold - Pt and Pt alloys, Au and Au alloys
Gold - Pure Au and Au-rich alloys, Pd and Pd alloys - General microstructure
Gold - Pure Au and Pd - General microstructure
Gold alloy - Electrolytic etching - General microstructure
Gold alloys - Chemical etching - General microstructure
Gold and gold alloys - Electrolytic polishing
Gold and high-noble metal alloys - Chemical etching
Gold and precious metals - Chemical etching - General microstructure
Gold single crystal - Electrolytic polishing
Gold, Pt and Pd alloys - Chemical etching - General macrostructure
Gold-Silver clad Palladium (Au-Ag, Pd) - Electric contact material
Gold-Silver-platinum (Au-Ag-Pt) - Electric contact material
Hard Au-Soft Au electroplate - Chemical etching
Metallic glass - Electrolytic thinning
Murakami's etchant - Gold-Plated Nickel-Iron (Au-Ni-Fe) - Electric contact material
Pure Au - Electrolytic etching - General microstructure
Pure Au and Au-rich alloys - Chemical etching - General microstructure
Pure Au and alloys - Chemical etching
Pure Au and alloys - Chemical etching
Recipe for Au on C and Al/W dendrites
Tri-iodide etchant - Au specimens and thin films - Chemical etching
Tri-iodine etchant - Au thin film deposits as a multilayer Au/Ni/Au/TiW/Si(100) substrate - Chemical etching
Tri-iodine etchant - AuGe (13%) alloy ribbon - Chemical etching

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